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ISSUANCE OF US$300,000,000 6.40% SENIOR GUARANTEED BONDS DUE 2021

2018-09-10
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ISSUANCE OF US$300,000,000 6.40% SENIOR GUARANTEED BONDS DUE 2021
上一篇
NOTICE OF LISTING ON THE STOCK EXCHANGE OF HONG KONG LIMITED - EXPAND LEAD LIMITED - U.S.$ 300,000,000 6.40% GUARANTEED BONDS DUE 2021
下一篇：
MONTHLY RETURN ON MOVEMENTS IN SECURITIES FOR 31 AUGUST 2018
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